Suitable for polymer material solidification and polymerization heating process
|
Temperature setting:Max:350℃(can be modified according to customer need)
|
Carbon film and FPCB drying process for PC board and thick film production
|
Different type of heating system can be chosen according to customer need
|
Heater is stable and long service life
|
Due to excellent chamber seal and insulation design, temperature rise between furnace surface and environment is less than 5℃
|
Special design of exhausting module (U.S.A Patent No:6761559B1), minimized volatile material condense inside the furnace chamber
|
It can be linked with a personal computer to setup, store, recall process parameters, and monitor/record the temperature status
|
Automatic monitoring, data recording during operation
|
THERMOTRACKER temperature profiling system(Option)
|