| Suitable for polymer material solidification and polymerization heating process
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| Temperature setting:Max:350℃(can be modified according to customer need)
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| Carbon film and FPCB drying process for PC board and thick film production
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| Different type of heating system can be chosen according to customer need
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| Heater is stable and long service life
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| Due to excellent chamber seal and insulation design, temperature rise between furnace surface and environment is less than 5℃
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| Special design of exhausting module (U.S.A Patent No:6761559B1), minimized volatile material condense inside the furnace chamber
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| It can be linked with a personal computer to setup, store, recall process parameters, and monitor/record the temperature status
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| Automatic monitoring, data recording during operation
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| THERMOTRACKER temperature profiling system(Option)
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