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TANGTECK EQUIPMENT INC. MILESTONES |
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1988 |
TANGTECK EQUIPMENT INC. was founded. |
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1989 |
New factory in Chung Li Shih was set up. |
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1990 |
Furnace contort software with temperature profiling function were developed. |
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1991 |
New reflow furnace with belt and chain rail system for transportation was developed. |
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1992 |
Factory was expanded. |
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Firing furnace for hybrid circuit manufactory was developed. |
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1993 |
N2 SMD reflow Furnace was developed |
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1995 |
Thermotracker PRO-1000 was developed |
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1996 |
Patent of improved conveyor system for reflow furnace were certified by Japan |
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1998 |
Firing furnace with 36¡¨ belt width was developed |
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Technical transfer of multi-loop controller from U.K. was done and was manufactured in Tangteck successfully. |
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High temp. reflow furnace for lead-free process was developed and delivered to ¡§ Bourns¡¨ Taiwan |
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1999 |
Patent on belt and chain rail transportation was certified by USA |
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2001 |
High temperature blower was developed and proceeded with mass production. |
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GRC heater repair process for IC FAB was developed |
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2002 |
SVG heater repair process for IC diffusion furnace was developed |
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THERMOTRACKER PRO-600 with 105¢X working temperature was developed. |
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VMU &VMM Heater repair process for IC diffusion furnace were developed. |
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2003 |
Ceramic Panel Heater production was developed |
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12 loops THERMOTRACKER for wafer T/C was developed. |
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Temperature profile system for surface finishing process was developed. |
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Patent on exhausting design for furnaces was certified by Taiwan and USA. |
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2004 |
The construction of new factory begins. |
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2005 |
New factory (Dayuan Plant )commenced production in 2005 |